Method for etching organic hardmasks

ABSTRACT

A method of etching or removing an organic hardmask overlying a low dielectric constant film in a lithographic process. The method includes providing a dielectric film having thereover an organic hardmask to be removed, the dielectric film having a dielectric constant no greater than about 4.0, introducing over the organic hardmask an ionizable gas comprising a mixture of hydrogen and an oxidizing gas, and applying energy to the mixture to create a plasma of the mixture. The method further includes contacting the organic hardmask with the plasma, with the organic hardmask being at a temperature in excess of 200° C., to remove the organic hardmask without substantially harming the underlying substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of prior application Ser. No.12/142,226 filed on Jun. 19, 2008, now pending, which is a continuationof prior application Ser. No. 11/263,148 filed on Oct. 31, 2005, nowissued as U.S. Pat. No. 7,399,712, the disclosures of which areincorporated by reference herein in their entireties.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a cleaning process used in asemiconductor lithographic manufacturing system and, in particular, to amethod for etching or removing an organic hardmask such as amorphous orspin-on carbon from a low dielectric constant film.

2. Description of Related Art

Integrated circuits (ICs) are fabricated on semiconductor wafersubstrates by a lithographic process. The lithographic process allowsfor a mask pattern of the desired circuit or portion thereof to betransferred via radiant energy of selected wavelengths to a photoresistfilm on a substrate. Those segments of the absorbed aerial image, whoseenergy exceeds a threshold energy of chemical bonds in the photoactivecomponent of the photoresist material, create a latent image in theresist. The latent image marks the volume of resist material that eitheris removed during the development process (in the case of positivephotoresist) or remains after development (in the case of negativephotoresist) to create a three-dimensional pattern in the resist film.In subsequent processing, the resulting resist film pattern is used asan etch mask to remove underlying substrates from the areas of thepatterned openings in the resist layer.

Damascene processing techniques are often used in integrated circuitmanufacturing, and involve forming inlaid metal conductors in trenchesand vias in a dielectric layer. Openings in a hardmask layer are used toetch the desired portions of the dielectric layer to form the trenchesand vias. The hardmask layer openings are themselves formed by etchingthrough openings formed in an overlying resist layer. Hardmasks indamascene process can be made from an organic layer, such as a-carbon oralpha-carbon.

The move from 248 nm to 193 nm wavelength lithography has increased thecomplexity of the masking integration, often requiring a multilayerstack to be deposited on top of the layer to be etched. An example ofthis is a three layer stack of an amorphous carbon hardmask layercovered by a SiON anti-reflective coating (ARC) layer on whichconventional resist can be spun and processed. After the resist isdeveloped, a fluorine dry etch transfers the pattern to the SiON layer.The resist is stripped in conjunction with an oxygen based etch processto remove a-carbon in the hardmask layer from the openings in the SiONlayer. A dielectric etch process then transfers the pattern from thea-carbon hardmask into an underlying dielectric layer used in a dualdamascene approach. Following the etching of the dielectric layer, thea-carbon hardmask layer must be removed prior to forming Cu or othermetal interconnects in the backend of the wafer process flow.

Sudijono et al. U.S. Pat. No. 6,787,452 discloses a method ofcontrolling a critical dimension during a photoresist patterning processwhich can be applied to forming vias and trenches in a dual damascenestructure. An amorphous carbon ARC is deposited on a substrate by aplasma enhanced chemical vapor deposition (PECVD) method. Thealpha-carbon layer provides a high etch selectivity relative to oxideand is disclosed as being readily removed by a plasma ashing step usingoxygen. Ye et al U.S. Pat. No. 6,458,516 teaches a method of removing apolymeric, organic masking layer using a hydrogen/nitrogen-based plasma.

Low dielectric constant (low-k) materials, i.e., those having adielectric constant generally below about 2.7 to 3.0, have been used indamascene processes as inter-metal and/or inter-layer dielectricsbetween conductive interconnects employed to reduce the delay in signalpropagation due to capacitive effects. The lower the dielectric constantof the dielectric material, the lower the capacitance of the dielectricand the lower the RC delay of the integrated circuit. Typically, low-kdielectrics are silicon-oxide based materials with some amount ofincorporated carbon, commonly referred to as carbon doped oxide (CDO).An example of a CDO is CORAL brand carbon-doped oxides, from NovellusSystems, Inc. of San Jose, Calif. It has been found that highlyoxidizing conditions are generally unsuitable for use on low-kmaterials. When exposed to an O₂ plasma, the oxygen scavenges or removescarbon from the low-k materials. In many of these materials such asCDOs, the presence of carbon is instrumental in providing a lowdielectric constant. Hence, to the extent that the oxygen removes carbonfrom these materials, it effectively increases the dielectric constant.As processes used to fabricate integrated circuits move toward smallerand smaller dimensions and requires the use of dielectric materialshaving lower and lower dielectric constants, it has been found that theconventional strip plasma conditions are not suitable.

Consequently, a need exists in the art for the development of analternative process that effectively removes organic hardmask layerssuch as amorphous carbon, and that does not remove excessive amounts ofthe low-k dielectric materials or otherwise materially alter theproperties of low-k dielectric materials.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, an improved method ofetching and/or removing an organic hardmask from wafer substrates in alithographic process is provided.

According to another aspect of the present invention, a method ofremoving an organic hardmask without damaging an underlying dielectriclayer is provided.

According to another aspect of the present invention, a method ofremoving an organic hardmask layer without damaging an underlying low-kdielectric layer is provided.

According to another aspect of the present invention, a method ofremoving an organic hardmask layer without affecting critical dimensionfeatures etched into an underlying low-k dielectric layer is provided.

The above and other aspects, which will be apparent to those skilled inart from the disclosure herein, are achieved in the present inventionwhich is directed to a method of etching or removing an organichardmask, such as an amorphous carbon organic hardmask, comprisingproviding a substrate having thereover an organic hardmask to beremoved, introducing over the substrate and organic hardmask anionizable gas comprising a mixture of hydrogen and an oxidizing gas, andapplying energy to the mixture to create a plasma of the mixture. Themethod then includes contacting the organic hardmask with the plasma,wherein the substrate and organic hardmask are at a temperature inexcess of 200° C., to remove at least a portion of the organic hardmaskand exposing the substrate without substantially harming the underlyingsubstrate.

Preferably, the organic hardmask is completely removed from theunderlying substrate.

In another aspect, the present invention is directed to a method ofremoving an organic hardmask overlying a low dielectric constant film ina lithographic process comprising providing a dielectric film havingthereover an organic hardmask to be removed, the dielectric film having,a dielectric constant no greater than about 4.0, and contacting theorganic hardmask with plasma comprising an ionized mixture of hydrogenand an oxidizing gas, wherein the dielectric film and organic hardmaskare at a temperature in excess of 200° C., to remove the organichardmask without substantially affecting the underlying dielectric film.

In a further aspect, the present invention is directed to a method ofetching or removing an organic hardmask overlying a low dielectricconstant film in a lithographic process comprising providing adielectric film having thereover an organic hardmask to be removed, thedielectric film having a dielectric constant no greater than about 4.0,introducing over the organic hardmask an ionizable gas comprising amixture of hydrogen and an oxidizing gas, and applying energy to themixture to create a plasma of the mixture. The method further includescontacting the organic hardmask with the plasma, wherein the dielectricfilm and organic hardmask are at a temperature in excess of 200° C., toremove the organic hardmask without substantially harming the underlyingsubstrate.

The organic hardmask may be chemical vapor deposited amorphous carbonand the substrate may be a dielectric film, such as a dielectric filmhaving a dielectric value less than about 3.0, for example, acarbon-doped oxide dielectric film.

The organic hardmask may be amorphous carbon, and the dielectric filmmay have a dielectric constant no greater than about 2.8.

The oxidizing gas may be provided from a source of carbon dioxide. Thegas mixture is preferably essentially nitrogen-free.

In other embodiments, the invention includes a wafer having a dielectriclayer including a plurality of dielectric materials including a bulklow-k dielectric underlying a capping dielectric, the capping dielectrichaving a higher k value than the bulk low-k dielectric. In someembodiments, the bulk low-k dielectric and the capping dielectric areboth low-k dielectrics. In other embodiments, the bulk low-k dielectricis a low-k dielectric and the capping dielectric is not a low-kdielectric.

In still other embodiments, the plurality of dielectric materials mayinclude discrete bulk low-k dielectric and capping dielectric layers, orthe plurality of dielectric materials may have a continuous, gradedtransition between the bulk low-k dielectric material and the cappingdielectric material.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention may best be understood by reference to the detaileddescription which follows taken in conjunction with the accompanyingdrawings in which:

FIGS. 1 and 1A are cross-sectional elevational views of an organichardmask, photoresist and other layers deposited on a wafer substrateover a low-k dielectric to be etched.

FIGS. 2 and 2A are cross-sectional elevational views of the wafersubstrate of FIGS. 1 and 1A, respectively, after the photoresist,organic hardmask and other layers over the low-k dielectric have beenetched.

FIGS. 3 and 3A are cross-sectional elevational views of the wafersubstrate of FIGS. 2 and 2A, respectively, after the layers over theetched organic hardmask layer have been removed.

FIGS. 4 and 4A are cross-sectional elevational views of the wafersubstrate of FIGS. 3 and 3A, respectively, after the low-k dielectrichas been etched through the organic hardmask layer.

FIGS. 5 and 5A are cross-sectional elevational views of the wafersubstrate of FIGS. 3 and 3A, respectively, after the organic hardmasklayer has been removed by the high temperature plasma method of thepresent invention, without damage to the low-k dielectric.

FIG. 6 is a schematic illustration showing an apparatus suitable forpracticing the present invention.

FIG. 7 is a simple block diagram showing a multi-station stripping toolsuitable for practicing the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

In describing the preferred embodiments of the present invention,reference will be made herein to the drawings in which like numeralsrefer to like features of the invention.

The present invention is directed to the removal of organic hardmaskmaterials used to form ashable hardmasks (AHM), such as amorphous carbonhardmasks, known as a-carbon or alpha-carbon, or spin-on hardmasks. Suchhardmasks may be formed on a substrate by chemical vapor deposition(CVD), spin-on, or other techniques. The AHM material generally isprimarily composed of carbon, for example, about 50-80 weight percent,with the remainder being hydrogen and possibly trace nitrogen. Examplesof starting materials used to form such films include CH₄ and C₂H₂, ormore generally C_(x)H_(y), wherein x=2 to 4 and y=2 to 10.

While the method of the present invention may be used to efficiently andeffectively to remove organic hardmask materials from low-k dielectricfilms, it is not limited to low-k dielectric films, or even todielectrics. The invention is also not limited to any particularcategory of low-k dielectrics. For instance, the present invention maybe effectively used with dielectrics with k values less than 4.0 (alsoknown as first generation low-k dielectrics), dielectrics with k valuesless than about 2.8 (second generation low-k dielectrics) anddielectrics with k values less than about 2.0 (ultra-low-k dielectrics).The low-k dielectric may be porous or non-porous (the latter sometimesreferred to as a dense low-k dielectric). Generally, dense low-kdielectrics are those having k values no greater than 2.8 and low-kporous dielectrics are those having k values no greater than 2.2. Low-kdielectrics of any suitable composition may be used, including siliconoxide based dielectrics doped with fluorine and/or carbon. Non-siliconoxide based dielectrics, such as polymeric materials, may also be used.Any suitable process may be used to deposit the low-k dielectric,including as spin-on deposit and CVD deposit techniques. In the case offorming porous dielectrics, any suitable method may be used. A typicalmethod involves co-depositing a silicon-based backbone and an organicporogen and subsequently removing the porogen component, leaving aporous dielectric film. Other methods include sol-gel techniques.Specific examples of suitable low-k films are carbon based spin-on typefilms sold under the trademark SiLK by Dow Chemicals, Inc. and CVDdeposited porous films sold under the trademark CORAL by NovellusSystems, Inc.

The organic hardmask is preferably etched and removed by reactive plasmaetching. In general, reactive plasma etching is performed in situ in aplasma reactor in which the processing chamber promotes excitationand/or disassociation of the reactant gases by the application of RFenergy with capacitively coupled electrodes disposed in the processingchamber. The plasma typically creates a highly reactive species thatreacts with and etches away the unwanted deposition material present inthe processing chamber. The present invention may use plasmas generatedwith microwave (MW), inductively coupled plasma (ICP) or in a parallelplate reactive ion etch (RIE) reactor.

The plasma reactor apparatus that may be used in practicing the presentinvention includes a vacuum pump for creating a vacuum in the processchamber. The apparatus of the invention also includes a process gasinlet assembly such as a pressurized gas cylinder coupled to an inletconduit connected to a gas distribution faceplate or showerhead in. theprocess chamber. The semiconductor wafer substrate or other workpiecerests on a pedestal or platen, which may apply a bias to the substrate.An RF or other power supply applies electrical power between the gasdistribution faceplate or showerhead and the pedestal to excite theprocess gas or mixture of gasses to form a plasma within the cylindricalreaction region between the faceplate and pedestal.

The ionizable process gas used in the present invention is preferably amixture of hydrogen and an oxygen-containing or oxidizing gas such as COor CO₂. The oxidizing gas preferably comprises from about 0.5 to 10volume percent of the mixture. Preferably, the gas mixture to be ionizedcontains no nitrogen, to avoid causing damage to any underlying CDOdielectric layers by incorporating nitrogen into the film, which isknown to create amine groups that can interact with photo resist tocause what is known as the resist poisoning effect. Sensitive resists,such as 193 nm resist, can react with amine groups which neutralizeacidic compounds in the resist and prevent them from properly developingand being removed in the solvent removal step of the lithographysequence, thus leaving residual resist in undesired areas of the wafer.With added Ar or He, there may be some benefit, but it has not beencharacterized with the H2+CO2 plasma. Using He or Ar in a RIE etch toolcould enhance the etch rate or could prove beneficial at the end of theprocess by sputtering off post etch polymers or other defects that areoften left on the wafer surface 25. Thus, there may be some benefit withrespect to leaving a clean wafer surface or a surface that has fewersubmicron defects.

It is important to keep the wafer temperature above about 200° C.,preferably above 250° C. and more preferably in the range of about250-350° C., during the plasma etching. A heating element may besupplied in the process chamber for such purpose. During operation, theplasma process gas moves from one side of the vacuum chamber to theother side due to the vacuum generated on the side of the vacuum chamberopposite the side from which the ionizable process gas flows into thechamber. The plasma process gas diffuses across the surface of the wafersubstrate removing the organic hardmask and carrying the volatilizedmaterial towards the vacuum pump assembly.

As shown in FIG. 1, a wafer 20 includes etch stop layer 22 over which isdeposited a low-k dielectric layer 24. An organic (e.g., amorphouscarbon) hardmask layer 26 is deposited over the low-k dielectric layer24. A resist layer 32, an optional organic (or spin on) antireflectivecoating (ARC) layer 30 and a dielectric ARC layer of SiOC (created byreacting CO₂ and Si(CH₃)₄), SiON or Si₃N₄ ARC layer 28 overlie theorganic hardmask layer. The resist layer is exposed to a device patternand developed to remove a volume of resist material corresponding to thepattern. As shown in FIG. 2, the opening 34 in remaining resist layer 32is then used as a mask to etch a corresponding volume of material fromthe ARC layers 28, 30 and organic hardmask layer 26.

The resist and ARC layers are then removed to leave organic hardmasklayer and etched pattern opening 34 over layer 24, as shown in FIG. 3.The resist layer and reside may be removed by processes disclosed inU.S. patent application Ser. Nos. 10/890,653, 11/011,273 and 11/128,930,the disclosures of which are hereby incorporated by reference.Typically, the wafer is typically subject to an ashing process to stripand remove the resist layer, for example by transfer to a plasma reactorand hydrogen plasma stripping of the low-k dielectric film. Afterstripping the resist and other overlying layers, the organic hardmasklayer is then used to etch the underlying low-k dielectric layer by, forexample, reactive ion etching (RIE), as shown in FIG. 4 where opening 34is continued down into low-k layer 24 to create an opening having walls36.

A more common method is for a wafer with the layers shown in FIG. 2 tobe exposed to the RIE etch, without removing the layers 32, 30, 28. Dueto the long etch time typically required by the RIE etch, the layers 32,30, 28 will be completely removed before the etch stop layer 22 isexposed. The resulting structure is shown in FIG. 4. This is achieved byexposing the structure shown in FIG. 2 to the RIE etch, thus skippingthe need for the separate resist/ARC removal step described above and inFIG. 3, and resulting in the FIG. 4 structure.

The wafer is then subject to the high temperature plasma cleaning methodof the present invention to remove the organic hardmask layer, leavingthe low-k dielectric layer undamaged and ready to receive a conductivemetal in opening 36. The plasma processing may be conducted in the samereactor used for the hydrogen plasma ashing process, but requires theuse of a heating element to achieve the desired reaction temperature.Subsequently, as shown in FIG. 5, the surface 25 of the dielectric layer24 is substantially free of a-carbon or other organic hardmask residue,and the dimensions of the etched via or trench 36 in the dielectriclayer are unaffected and not subject to any damage such as by erodedsidewalls 36′.

In a Novellus Systems Iridia 200 mm etch tool, the wafer comprising theorganic hardmask layer overlying the low-k dielectric layer is heated byheat lamps to a typical temperature of 280° C. Microwave power in therange of about 1000-3000 W, typically about 1800 W, at 2.45 GHz may beapplied to a H₂/CO₂ gas mixture flowing at a rate of about 500-4000sccm, typically about 1800 sccm, into the chamber maintained at apressure in the range of 750-4000 mT, typically 1000 mT. After aprocessing time of between about 30 and 180 seconds, typically about 90seconds, the organic hardmask layer is removed without substantialdamage to the low-k dielectric layer.

In a Novellus Systems Gamma tool, the wafer comprising the organichardmask layer overlying the low-k dielectric layer is heated by anelectrical resistance heated platen to a typical temperature of 280° C.RF power in the range of about 500-3000 W, typically about 2000 W, at3.56 MHz may be applied to a H₂/CO₂ gas mixture flowing at a rate ofabout 5000-40000 sccm, typically about 20000 sccm, into the chambermaintained at a pressure in the range of 750-4000 mT, typically 1100 mT.The tool contains from 4 to 6 platens, and the wafer is moved throughall of the platens during the etch processing. After a total processingor plasma exposure time of between about 20 and 180 seconds, typicallyabout 90 seconds, the organic hardmask layer is removed withoutsubstantial damage to the low-k dielectric layer.

In a Novellus Systems Iridia 300 mm Sierra etch tool having a dual powersource, the wafer comprising the organic hardmask layer overlying thelow-k dielectric layer is heated to a typical temperature of 280° C.Microwave power in the range of about 1000-3000 W, typically about 1800W, at 2.45 GHz may be applied to a H₂/CO₂ gas mixture flowing at a rateof about 500-4000 sccm, typically about 1800 sccm, into the chambermaintained at a pressure in the range of 750-4000 mT, typically 1000 mT.The platen supporting the wafer is inside a RF plasma reaction chamber,and is coupled to the RF source which supplies power in the range of500-2000 W, typically 1000 W, at 3.56 MHz. After a processing time ofbetween about 30 and 180 seconds, typically about 90 seconds, theorganic hardmask layer is removed without substantial damage to thelow-k dielectric layer.

The gas flow rate, RF power setting, time of exposure and otherparameters may be adjusted to achieve desired results for other cleaningtasks.

Thus, the present invention provides an improved method of etchingand/or removing organic hardmask layers from wafer substrates in alithographic process, particularly when removing amorphous carbon from alow-k dielectric layer. The present invention achieves such organichardmask removal and without damaging the underlying low-k dielectricsubstrate.

Other Embodiments

In addition to the embodiments described with reference to FIGS. 1 to 5above, there are other embodiments of the present invention, describedbelow with reference to FIGS. 1A-5A, 6 and 7.

As shown in FIG. 1A, another embodiment of the invention includes awafer 20 having an etch stop layer 22 over which is deposited a low-kdielectric layer 24. The dielectric layer 24, includes a plurality ofdielectric materials including a bulk low-k dielectric underlying acapping dielectric, the capping dielectric having a higher k value thanthe bulk low-k dielectric. In some embodiments, the bulk low-kdielectric and the capping dielectric are both low-k dielectrics. Inother embodiments, the bulk low-k dielectric is a low-k dielectric andthe capping dielectric is not a low-k dielectric.

In some specific embodiments, the bulk low-k dielectric can be anultra-low-k (ULK) dielectric, for example one having a k of about 2.2,and the capping dielectric can be a carbon-doped oxide (CDO) having a kof about 2.9.

In other specific embodiments, the bulk layer can be a carbon-dopedoxide (CDO) having a k of about 2.9 and the capping layer cantetraethylorthosilicate (TEOS) having a k of about 4.0.

In still other embodiments, the plurality of dielectric materials mayinclude discrete bulk low-k dielectric and capping dielectric layers;that is, separate, adjacent dielectric layers. Or, the plurality ofdielectric materials may have a continuous, graded transition betweenthe bulk low-k dielectric material and the capping dielectric material.Such a graded transition may be substantially uniform from one side ofthe dielectric layer 24 to the other. Or it may be non-uniform with atransition from one dielectric to the other over just a portion of thetotal thickness of the dielectric 24, for example over a thickness ofless than 50%, or less than 25%, or less than 10%, or less than 5% ofthe total thickness of the dielectric 24.

An organic carbon hardmask layer 26 is deposited over the low-kdielectric layer 24. A resist layer 32, an optional organic (or spin on)antireflective coating (ARC) layer 30 and a dielectric ARC layer of SiOC(created by reacting CO₂ and Si(CH₃)₄), SiON or Si₃N₄ ARC layer 28overlie the organic hardmask layer. The resist layer is exposed to adevice pattern and developed to remove a volume of resist materialcorresponding to the pattern. As shown in FIG. 2A, the opening 34 inremaining resist layer 32 is then used as a mask to etch a correspondingvolume of material from the ARC layers 28, 30 and organic hardmask layer26.

The resist and ARC layers are then removed to leave organic hardmasklayer and etched pattern opening 34 over layer 24, as shown in FIG. 3A,such that the dielectric layer 24 underlying the hardmask layer 26 isexposed. The resist layer and reside may be removed by processesdisclosed in U.S. patent application Ser. Nos. 10/890,653, 11/011,273and 11/128,930, the disclosures of which are hereby incorporated byreference. Typically, the wafer is subject to an ashing process to stripand remove the resist layer, for example by transfer to a plasma reactorand hydrogen plasma stripping of the low-k dielectric film. Afterstripping the resist and other overlying layers, the organic hardmasklayer is then used to etch the underlying low-k dielectric layer by, forexample, reactive ion etching (RIE), as shown in FIG. 4A where opening34 is continued down into low-k layer 24 to create an opening havingwalls 36, further exposing the dielectric layer 24.

A more common method is for a wafer with the layers shown in FIG. 2A tobe exposed to the RIE etch, without removing the layers 32, 30, 28. Dueto the long etch time typically required by the RIE etch, the layers 32,30, 28 will be completely removed before the etch stop layer 22 isexposed. The resulting structure is shown in FIG. 4A. This is achievedby exposing the structure shown in FIG. 2 to the RIE etch, thus skippingthe need for the separate resist/ARC removal step described above and inFIG. 3A, and resulting in the FIG. 4A structure.

The wafer is then subject to the high temperature plasma cleaning methodof the present invention to remove the organic hardmask layer, leavingthe low-k dielectric layer undamaged and ready to receive a conductivemetal in opening 36. In particular it is noted that the low-k dielectricexposed during the removal of the hardmask in undamaged by that removalprocess. The plasma processing may be conducted in the same reactor usedfor the hydrogen plasma ashing process, but requires the use of aheating element to achieve the desired reaction temperature.Subsequently, as shown in FIG. 5A, the surface 25 of the dielectriclayer 24 is substantially free of a-carbon or other organic hardmaskresidue, and the dimensions of the etched via or trench 36 in thedielectric layer are unaffected and not subject to any damage such as byeroded sidewalls 36′.

Apparatus

Any suitable plasma reaction chamber apparatus may be used to implementthe present invention, including the Gamma and Iridia tools noted above.Further in this regard, a suitable example is a Novellus Gamma™ 2130tool which is configured with a downstream plasma setup. FIG. 6 is aschematic illustration showing aspects of a downstream plasma apparatus600 suitable for practicing the present invention on wafers. Apparatus600 has a plasma producing portion 611 and an exposure chamber 601separated by a showerhead assembly 617. Inside exposure chamber 601, awafer 603 rests on a platen (or stage) 605. Platen 605 is fitted with aheating/cooling element. In some embodiments, platen 605 is alsoconfigured for applying a bias to wafer 603. Low pressure is attained inexposure chamber 601 via vacuum pump via conduit 607. Sources of gaseoushydrogen (with or without dilution/carrier gas) and carbon dioxide (orother weak oxidizing agent) provide a flow of gas via inlet 609 intoplasma producing portion 611 of the apparatus. Plasma producing portion611 is surrounded in part by induction coils 613, which are in turnconnected to a power source 615. During operation, gas mixtures areintroduced into plasma producing portion 611, induction coils 613 areenergized and a plasma is generated in plasma producing portion 611.Showerhead assembly 617, which has an applied voltage, terminates theflow of some ions and allows the flow of neutral species into exposurechamber 601. As mentioned, wafer 603 may be temperature controlledand/or a RF bias may be applied.

In some embodiments, the apparatus of the invention is a strip unitdedicated to stripping photoresist from wafers. Generally, such a stripunit tool will have multiple wafer process stations so that multiplewafers may be processes simultaneously. FIG. 7 is a simple block diagramshowing a top-down view of a multi-station wafer strip unit tool 730that may be used in accordance with the invention. Strip unit tool 730has five strip stations 733, 735, 737, 739 and 741 and one load station731. Strip unit tool 730 is configured such that each station is capableof processing one wafer and so all stations may be exposed to a commonvacuum. Each of strip stations 733, 735, 737, 739 and 741 has its own RFpower supply. Load station 731 is typically configured with a load-lockstation attached thereto to allow the input of wafers into strip unittool 730 without a break in vacuum. Load station 731 is also typicallyconfigured with a heat lamp to pre-heat wafers before transferring tostrip stations and photoresist stripping. Strip station 741 is typicallyconfigured with a load-lock station attached thereto to allow the outputof wafers from strip unit tool 730 without a break in vacuum. A roboticarm 743 transfers wafers from station to station.

During typical manufacturing mode, wafers are processed in batch mode.Batch mode processing can increase wafer through-put and is thereforecommonly used in manufacturing operation. In batch mode, each wafer istransferred to, and processed in, each of stations 731, 733, 735, 737,739 and 741. For example, a typical batch mode process will proceed asfollows: A wafer is first loaded into load station 731 where it ispreheated with a heat lamp. Next, robotic arm 743 transfers the wafer tostrip station 733 where it is plasma processed for a time periodsufficient to strip off about ⅕ of the photoresist. Robotic arm 743 thentransfers the wafer to strip station 735 where it is plasma processedfor a time period sufficient to strip off about another ⅕ of theremaining photoresist. This sequence is continued such that the wafer isprocessed at strip stations 737, 739 and 741. At strip station 741, thephotoresist should be largely removed and wafer 741 is then unloadedfrom the strip unit tool.

Other tools suitable for implementing the present invention include GxT™and G400™ photoresist strip tools available from Novellus Systems, Inc.,a 2300 Flex™ etch tool available for Lam Research, a Telius™ etch toolavailable from Tokyo Electron Limited, or a Producer™ etch toolavailable from Applied Materials.

It should be generally understood that the apparatus/process describedhereinabove may be used in conjunction with lithographic patterningtools or processes, for example, for the fabrication or manufacture ofsemiconductor devices, displays, LEDs, photovoltaic panels and the like.Typically, though not necessarily, such tools/processes will be used orconducted together in a common fabrication facility. Lithographicpatterning of a film typically comprises some or all of the followingsteps, each step enabled with a number of possible tools: (1)application of photoresist on a substrate, i.e., substrate, using aspin-on or spray-on tool; (2) curing of photoresist using a hot plate orfurnace or UV curing tool; (3) exposing the photoresist to visible or UVor x-ray light with a tool such as a wafer stepper; (4) developing theresist so as to selectively remove resist and thereby pattern it using atool such as a wet bench; (5) transferring the resist pattern into anunderlying film or substrate by using a dry or plasma-assisted etchingtool; and (6) removing the resist using a tool such as an RF ormicrowave plasma resist stripper.

Another aspect of the invention is an apparatus configured to accomplishthe methods described herein. A suitable apparatus includes hardware foraccomplishing the process operations and a system controller havinginstructions for controlling process operations in accordance with thepresent invention. A suitable plasma reaction chamber apparatus, such asthe Gamma and Iridia tools or others noted above may be adapted in thisway. The system controller will typically include one or more memorydevices and one or more processors configured to execute theinstructions so that the apparatus will perform a method in accordancewith the present invention. Machine-readable media containinginstructions for controlling process operations in accordance with thepresent invention may be coupled to the system controller.

While the present invention has been particularly described, inconjunction with specific preferred embodiments, it is evident that manyalternatives, modifications and variations will be apparent to thoseskilled in the art in light of the foregoing description. It istherefore contemplated that the appended claims will embrace any suchalternatives, modifications and variations as falling within the truescope and spirit of the present invention.

1. A method of etching or removing an organic hardmask comprising:providing a semiconductor wafer substrate comprising an exposed low-kdielectric and having thereover an organic hardmask to be removed;introducing over the substrate and organic hardmask an ionizable gascomprising a mixture of hydrogen and an oxidizing gas; applying energyto the mixture to create a plasma of the mixture; and contacting theorganic hardmask with the plasma, wherein the substrate and organichardmask are at a temperature in excess of 200° C., to remove at least aportion of the organic hardmask and exposing the substrate withoutsubstantially harming the underlying substrate.
 2. The method of claim1, wherein the organic hardmask comprises chemical vapor depositedamorphous carbon.
 3. The method of claim 1, wherein the organic hardmaskcomprises a spin-on carbon film.
 4. The method of claim 1, wherein thesubstrate comprises a dielectric film having a dielectric value (k) lessthan about 2.5.
 5. The method of claim 1, wherein the substratecomprises a dielectric film having a dielectric value (k) less thanabout 3.0.
 6. The method of claim 4, wherein the dielectric filmcomprises a single carbon-doped oxide dielectric material having adielectric value (k) less than about 3.0.
 7. The method of claim 4,wherein the dielectric film comprises a plurality of dielectricmaterials.
 8. The method of claim 7, wherein the plurality of dielectricmaterials comprise a bulk low-k dielectric underlying a cappingdielectric, the capping dielectric having a higher k value than the bulklow-k dielectric.
 9. The method of claim 8, wherein both the bulk low-kdielectric and the capping dielectric are low-k dielectrics.
 10. Themethod of claim 8, wherein the bulk low-k dielectric is a low-kdielectric and the capping dielectric is not a low-k dielectric.
 11. Themethod of claim 8, wherein the bulk low-k dielectric is an ultra-low-k(ULK) dielectric having a k of about 2.2 and the capping dielectric is acarbon-doped oxide (CDO) having a k of about 2.9.
 12. The method ofclaim 8, wherein the bulk layer is a carbon-doped oxide (CDO) having a kof about 2.9 and the capping layer is tetraethylorthosilicate (TEOS)having a k of about 4.0.
 13. The method of claim 8, wherein theplurality of dielectric materials comprise discrete bulk low-kdielectric and capping dielectric layers.
 14. The method of claim 8,wherein the plurality of dielectric materials comprise a gradedtransition between the bulk low-k dielectric material and the cappingdielectric material.
 15. The method of claim 1, wherein the gas mixtureis nitrogen-free.
 16. The method of claim 1, wherein the organichardmask is completely removed from the underlying substrate.
 17. Amethod of removing an organic hardmask overlying a dielectric film in alithographic process comprising: providing a semiconductor wafer havinga dielectric film, the dielectric film being partially exposed andhaving thereover an organic hardmask to be removed, the dielectric filmhaving a dielectric constant no greater than about 4.0; contacting theorganic hardmask with plasma comprising an ionized mixture of hydrogenand an oxidizing gas, wherein the dielectric film and organic hardmaskare at a temperature in excess of 200° C., to remove the organichardmask without substantially affecting the underlying dielectric film.18. The method of claim 17, wherein the organic hardmask comprises acarbon film.
 19. The method of claim 17, wherein the dielectric film hasa dielectric constant no greater than about 2.8.
 20. A method of etchingor removing an organic hardmask overlying a dielectric film in alithographic process comprising: providing a semiconductor wafer havinga dielectric film, the dielectric film being partially exposed andhaving thereover an amorphous carbon organic hardmask to be removed, thedielectric film having a dielectric constant no greater than about 4.0;introducing over the organic hardmask an ionizable gas comprising amixture of hydrogen and an oxidizing gas; applying energy to the mixtureto create a plasma of the mixture; and contacting the organic hardmaskwith the plasma, wherein the dielectric film and organic hardmask are ata temperature in excess of 200° C., to remove the organic hardmaskwithout substantially harming the underlying substrate.
 21. The methodof claim 21, wherein the dielectric film has a dielectric constant nogreater than about 3.0.
 22. The method of claim 21, further comprisingthe steps of: applying photoresist to the substrate; exposing thephotoresist to light; patterning the resist and transferring the patternto the substrate; and, selectively removing the photoresist from thesubstrate.
 23. An apparatus for etching or removing an organic hardmaskoverlying a dielectric film, the apparatus comprising: (a) a plasmareaction chamber apparatus; and (b) a controller comprising programinstructions for conducting a process comprising the steps of: providinga semiconductor wafer substrate comprising an exposed low-k dielectricand having thereover an organic hardmask to be removed; introducing overthe substrate and organic hardmask an ionizable gas comprising a mixtureof hydrogen and an oxidizing gas; applying energy to the mixture tocreate a plasma of the mixture; and contacting the organic hardmask withthe plasma, wherein the substrate and organic hardmask are at atemperature in excess of 200° C., to remove at least a portion of theorganic hardmask and exposing the substrate without substantiallyharming the underlying substrate.
 24. A system comprising the apparatusof claim 23 and a stepper.
 25. A non-transitory computermachine-readable medium comprising program instructions for control of aplasma reaction chamber apparatus, the program instructions comprising,code for providing a semiconductor wafer substrate comprising an exposedlow-k dielectric and having thereover an organic hardmask to be removed;code for introducing over the substrate and organic hardmask anionizable gas comprising a mixture of hydrogen and an oxidizing gas;code for applying energy to the mixture to create a plasma of themixture; and code for contacting the organic hardmask with the plasma,wherein the substrate and organic hardmask are at a temperature inexcess of 200° C., to remove at least a portion of the organic hardmaskand exposing the substrate without substantially harming the underlyingsubstrate.